Satisfacer las demandas aceleradas de la fabricación de productos electrónicos modernos requiere precisión, y ahí es donde entran en juego nuestras capacidades de tecnología de montaje superficial (SMT). Fenix se especializa en ensamblar de manera eficiente componentes electrónicos compactos e intrincados en placas de circuitos impresos (PCB), lo que garantiza una calidad y confiabilidad de primer nivel para cada proyecto.
Ya sea que esté desarrollando un prototipo o pasando a la producción a gran escala, nuestros servicios SMT están diseñados para adaptarse a sus necesidades. Utilizando el equipo y la tecnología más modernos, garantizamos una alta precisión y consistencia, lo que nos convierte en un socio de confianza para industrias como las telecomunicaciones, la electrónica de consumo y la automoción.
Nuestro enfoque en la velocidad, la precisión y la flexibilidad significa que sus productos llegarán al mercado más rápido, sin comprometer el rendimiento. Fenix está listo para satisfacer sus necesidades de fabricación electrónica con la experiencia y la tecnología para ofrecer resultados excepcionales.
SMT is a method of assembling electronic components onto a printed circuit board (PCB) by directly mounting them onto its surface. It allows for smaller, lighter, and more efficient circuit designs compared to traditional through-hole technology (THT).
A PCB is a flat board made of insulating material with conductive pathways (traces) that connect electronic components. PCBs are used in computers, smartphones, industrial equipment, and nearly all modern electronics.
PCBA refers to a fully assembled PCB with all electronic components mounted and soldered. This assembly process involves SMT, through-hole technology (THT), and soldering techniques like reflow and wave soldering.
PCB layout is the design process of arranging electronic components and routing conductive traces on a PCB. It ensures optimal signal integrity, power distribution, and manufacturability.
A solder mask is a protective layer applied over a PCB’s copper traces to prevent solder bridges and oxidation. It is typically green, but other colors like red, blue, and black are also used.
Solder paste application is the process of depositing solder paste onto a PCB’s pads before placing SMT components. It ensures strong electrical connections during reflow soldering.
A stencil is a thin metal sheet (usually stainless steel) with laser-cut openings that allows precise application of solder paste onto PCB pads before component placement.
Pick & Place refers to automated robotic machines that accurately place electronic components onto PCBs. These machines use vision systems to align components with precision.
Reflow soldering is a process where a PCB with solder paste and placed components is heated in a controlled oven to melt the solder, forming strong electrical connections.
AOI is an automated vision system that scans PCBs to detect soldering defects, component misplacement, and missing parts. It ensures quality control in SMT assembly.
X-ray inspection is a non-destructive testing method used to check hidden solder joints, such as those in Ball Grid Arrays (BGAs). It detects voids, cracks, and solder defects.
Functional testing evaluates whether a fully assembled PCB performs its intended function by applying power and testing circuit behavior under real operating conditions.
ICT is a high-speed electrical test that checks continuity, shorts, component values, and solder quality on a PCB using bed-of-nails fixtures.
Flying probe testing is a cost-effective method for testing PCBs using moving test probes instead of fixed test fixtures. It is ideal for low-volume or prototype PCBs.
Burn-in testing subjects electronic components or PCBs to high temperatures, voltage stress, and load conditions to detect early failures and ensure long-term reliability.
A bed of nails is a custom test fixture with multiple spring-loaded probes that simultaneously test many points on a PCB, allowing quick electrical testing in production lines.
Resistors are passive electronic components that limit current flow and divide voltage in a circuit. Their resistance is measured in ohms (Ω).
Capacitors store and release electrical energy, helping to filter signals, smooth power supply variations, and enable AC signal coupling. They are measured in farads (F).
Inductors are coil-shaped components that store energy in a magnetic field when current flows through them. They are used in power supplies, RF circuits, and transformers.
ICs are miniature semiconductor devices that contain multiple transistors, resistors, and capacitors on a single chip. They function as processors, memory chips, amplifiers, and controllers.
Diodes are semiconductor devices that allow current to flow in only one direction, used for rectification, voltage regulation, and signal demodulation.
Transistors are semiconductor components that act as electronic switches or amplifiers. They are fundamental in logic circuits, amplifiers, and power regulation.
BGAs are high-density semiconductor packaging types where solder balls are arranged on the underside of the chip. They provide strong electrical connections but require X-ray inspection for quality control.
Connectors are electromechanical components that join PCBs, wires, or cables to enable signal transmission and power distribution.
RF modules are wireless communication components used to transmit and receive radio frequency signals in devices like Wi-Fi, Bluetooth, IoT, and GPS systems.
Aiken, SC 29801
sales@fenix-mfg.com, Estados Unidos
San Pedro De Macoris
(809) 529-4421, Dominican Republic
Fenix – USA.
2969 Wagener Road
Aiken, SC 29801
Fenix – DR
San Pedro Industrial Free Zone
San Pedro De Macorís, República Dominicana
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